Avo Photonics provides high accuracy placement of Die and components. The current standard for Die placement is +/- 7 microns, 3-sigma and 0.3 degrees (yaw). However, with proper Submount design and high quality Die and Submount fabrication (edge sharpness, fiducial definition, etc), tighter placement accuracy can be achieved. Though the majority of Avo's bonding utilizes flux-free solders (AuSn, SnAg, In/x) we also support epoxy attach. Bonding can be performed either in-situ or post placement - both within non-oxidizing environments.

Avo has a wealth of experience bonding laser die to various ceramic submounts, silicon benches, as well as metal mounts such as C-Mounts

In addition, Avo can provide Scribe & Break of wafers for singulation and tape demounting to individual die.