Avo Photonics provides hermetic sealing of various package configurations. Parallel Seam Sealing, Rotary Seam Sealing, and Projection Welding are the most common supported approaches to hermeticity. Typically, parallel resistance welding is used for rectangular or square packages. Orbital or rotary seam sealing is applied for round and large TO-can style packages (>9mm). Projection welding is utilized on small (TO-56, 49, 38,...) assemblies.

For high volumes, a matrix system with vision recognition is used to automate Lid pick and place; ensuring placement accuracy to 50 um. This existing equipment enables the use of less expensive lids without internal step features.

Vacuum Bake-Out of all assembly components proceeds sealing. This process assists in removal of adsorbed layers (volatile residues) from package/component surfaces. Oven profiles are recorded; logging temperatures, vacuum level, and Nitrogen backfills.

Following vacuum bake-out, parts are moved to an integral glove box pressurized with the defined gas(es) for sealing into the package. Though these gases typically are Nitrogen+Helium or Dry Air, Avo can support whatever is required by the Product. The sealing process is followed by Leak Testing.