We seek a diligent, dedicated and meticulous person who will help further our success and reputation in the industry through world-class customer service. The successful candidate must plan his/her work schedule, keep multiple records, be self-motivated, maintain a professional presence, and have the desire to take ownership.
Responsibilities:
Develop automated routines for die placement using fiducials on submount and chip.
Optimize die bonding parameters using DOE approach.
Perform die shear tests to validate process.
Create documentation and provide training on resultant processes to production personnel.
Troubleshoot die bonding equipment.
Understand and provide solder stack recommendations for optomechanical assemblies.
Define and implement preventive maintenance protocols for multiple die bonders.
Maintain and expand database of process parameters and fixtures for developed processes.
Requirements:
B.S. in Engineering or Science field.
Three years of experience working with die bonding equipment.
Experience in DOE and SPC.
Good communication skills and willingness to learn.
Avo Photonics offers competitive salaries and a comprehensive benefits package.
Equal Opportunity Employer: Avo Photonics is not accepting unsolicited assistance from search firms for this employment opportunity. All resumes submitted by search firms to any employee of Avo Photonics by any method without a valid written contract in place with Avo Photonics will be deemed the sole property of Avo Photonics. No fee will be paid in the event the candidate is hired by Avo Photonics as a result of the referral or through any other means.
